Collaborative R&D Projects
PIXEurope Collaborative R&D Projects use open innovation to accelerate Pilot Line technology development and strengthen the PIC ecosystem.
Picture credits: Tyndall
Let’s build together
the future of integrated photonics.
The PIXEurope Collaborative R&D Projects model harnesses the considerable ongoing developments within the wider research community. It is specifically targeted at users at the heart of Europe’s PIC ecosystem who wish to join forces with PIXEurope Partners to accelerate the technological progress of the Pilot Line. In contrast to the other PIXEurope services, Collaborative R&D Projects adhere strictly to the work plan of the Pilot Line, and results from Collaborative R&D Projects must be available through services to all eligible users. The goal is to accelerate the technology development through open innovation. Collaborators need to already finance their own equivalent activities. Successful projects will accelerate both the capabilities of users and also the wider Pilot Line ecosystem.
Monolithic integration platforms
- Ultra-low-loss and moderate loss silicon nitride platforms, including component integration such as waveguides, modulators and fibre-chip coupling.
- Visible light silicon nitride platform, including development of silicon nitride–based integrated components operating in the visible spectral range (400–700 nm).
- Near infrared plaforms with high density integration.
- Indium Phosphide manufacturing technologies for precision and building block performance through equipment and process innovations in the O-band, C-band and at 2 micron wavelengths.
Heterogeneous Integration
- Integration process flows that are scalable to high volumes and at high speeds, including the integration of SiN/SiP/InP PICs, the integration with electronic driving chips and packaging and assembly into multi-chip modules.
- Development of hybrid material platforms including colloidal quantum dots, graphene and thin-film lithium niobate.
Metrology
- Improving test through accuracy, reliability, throughput, speed and scalability.
- Wafer Level Test, inspection up to 300mm, the development of Automated Test Equipment for photonics with standardization of data flows are in scope.
- Advanced material characterization of PIC structures.
Packaging
- Areas of interest include fibre-chip coupling approaches, photonic-electronic co-packaging, automated assembly and alignment processes, thermal management, and package architectures that improve manufacturability, reliability, testability and high-volume deployment across the PIXEurope ecosystem.
- Interposer technology both for optical and electrical connectivity.
Demonstrator circuits
- Optical switching devices.
Not for public use but for internal Gateway operations only
ICFO can offer Collaborative R&D projects in several areas related to PIXEurope’s tasks. More specifically in the development of hybrid material platforms including colloidal quantum dots, graphene and thin-film lithium niobate (WP6), interposer technology both for optical and electrical connectivity (WP7), advanced material characterization of PIC structures (WP8), and optical switching devices (WP9).
Development of silicon nitride–based integrated components operating in the visible spectral range (400–700 nm). In parallel, enhancement of integration density in the near‑infrared (NIR) through advanced lithography and/or stoichiometry tuning of SiN films while maintaining moderate optical losses. In addition, the integration of new functionalities in the NIR or visible, such as modulation and/or photodetection.
I think that for us the activities all fall under heterogeneous integration, so no additional description needed. Perhaps just change SiN/InP to SiN/Si/InP in the description.